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Bamboo Nail: A Novel Connector for Timber Assemblies

Yehan Xu, Zhifu Dong, Chong Jia, Zhiqiang Wang*, Xiaoning Lu*

College of Materials Science and Engineering, Nanjing Forestry University, Nanjing, 210037, China

* Corresponding Authors: Zhiqiang Wang. Email: email; Xiaoning Lu. Email: email

(This article belongs to the Special Issue: Renewable building materials and properties)

Journal of Renewable Materials 2021, 9(9), 1609-1620. https://doi.org/10.32604/jrm.2021.015193

Abstract

Nail connection is widely used in engineering and construction fields. In this study, bamboo nail was proposed as a novel connector for timber assemblies. Penetration depth of bamboo nail into wood was predicted and tested. The influence of nail parameters (length, radius and ogive radius) on penetration depth were verified. For both tested and predicted results, the penetration depth of bamboo nail increased with the increasing length, radius or ogive radius. In addition, the effect of densification on penetration depth or mechanical properties was evaluated. 1.12 g/cm3 was a critical density when densification was needed, and further increment of density would decrease the penetration depth of nail. The results of this study manifests that the proposed model is capable to predict the penetration depth of bamboo nail. These findings may provide new insight into efficiently utilization of bamboo resources.


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APA Style
Xu, Y., Dong, Z., Jia, C., Wang, Z., Lu, X. (2021). Bamboo nail: A novel connector for timber assemblies. Journal of Renewable Materials, 9(9), 1609-1620. https://doi.org/10.32604/jrm.2021.015193
Vancouver Style
Xu Y, Dong Z, Jia C, Wang Z, Lu X. Bamboo nail: A novel connector for timber assemblies. J Renew Mater. 2021;9(9):1609-1620 https://doi.org/10.32604/jrm.2021.015193
IEEE Style
Y. Xu, Z. Dong, C. Jia, Z. Wang, and X. Lu, “Bamboo Nail: A Novel Connector for Timber Assemblies,” J. Renew. Mater., vol. 9, no. 9, pp. 1609-1620, 2021. https://doi.org/10.32604/jrm.2021.015193



cc Copyright © 2021 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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