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Numerical Modelling of the Transient Hygroscopic Behavior of Flax-Epoxy Composite

by Wajdi Zouari1, Mustapha Assarar1, Abderrazak Chilali2, Rezak Ayad1, Hocine Kebir3

Université de Reims Champagne-Ardenne, ITheMM EA 7548, 51097, Reims, France.
Ecole Nationale Préparatoire aux Etudes d’Ingéniorat, 16012, Rouïba, Algeria.
Sorbonne Universités, Université de Technologie de Compiègne, Laboratoire Roberval (UMR 7337), 60205, Compiègne, France.

*Corresponding Author: Wajdi Zouari. Email: email.

Journal of Renewable Materials 2019, 7(9), 839-853. https://doi.org/10.32604/jrm.2019.06773

Abstract

This contribution deals with the development of a three-node triangular plane finite element to analyze the transient hygroscopic behavior of 2/2 twill flax fabric-reinforced epoxy composite. Several plates of this material were fabricated using the vacuum infusion process and composite specimens were then cut and aged in tap water at room temperature until saturation. To simplify, a plane modelling of water diffusion in the aged specimens is adopted and Fick’s model is used to describe the water diffusion kinetics. To highlight the heterogeneity of the flax-epoxy samples, the twill flax fabrics waviness is modelled with a sinusoidal undulation. In particular, we show that the proposed finite element formulation allows estimating the flax fiber radial diffusion coefficient by an inverse approach.

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APA Style
Zouari, W., Assarar, M., Chilali, A., Ayad, R., Kebir, H. (2019). Numerical modelling of the transient hygroscopic behavior of flax-epoxy composite. Journal of Renewable Materials, 7(9), 839-853. https://doi.org/10.32604/jrm.2019.06773
Vancouver Style
Zouari W, Assarar M, Chilali A, Ayad R, Kebir H. Numerical modelling of the transient hygroscopic behavior of flax-epoxy composite. J Renew Mater. 2019;7(9):839-853 https://doi.org/10.32604/jrm.2019.06773
IEEE Style
W. Zouari, M. Assarar, A. Chilali, R. Ayad, and H. Kebir, “Numerical Modelling of the Transient Hygroscopic Behavior of Flax-Epoxy Composite,” J. Renew. Mater., vol. 7, no. 9, pp. 839-853, 2019. https://doi.org/10.32604/jrm.2019.06773

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cc Copyright © 2019 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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