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Effect of Epoxidized Jatropha Oil on the Cure, Thermal, Morphological and Viscoelastic Properties of Epoxy Resins

A. Sammaiah1, K. V. Padmaja1, K. I. Suresh*,2, R. B. N. Prasad1

Centre for Lipid Research, CSIR-Indian Institute of Chemical Technology, Hyderabad – 500 007, India
Polymers and Functional Materials Division, CSIR-Indian Institute of Chemical Technology, Hyderabad – 500 007, India

*Corresponding author: email

Journal of Renewable Materials 2016, 4(2), 113-122. https://doi.org/10.7569/JRM.2015.634118

Abstract

This article reports the effect of epoxidized jatropha oil (EJO) on the thermal, cure and viscoelastic properties of epoxy resins. Epoxidized jatropha oil with an oxirane value of 5.0 was prepared and epoxy formulations containing different concentrations of EJO were evaluated for cure, morphology, thermal and viscoelastic properties. The curing temperature of the formulations increased with increasing EJO content. The glass transition temperature of the cured films decreased from 56 °C for unmodified epoxy resin to 23 °C for the sample with 60 wt% EJO reactive diluent, suggesting good plasticizing action. The thermal decomposition was only marginally affected.

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APA Style
Sammaiah, A., Padmaja, K.V., Suresh, K.I., Prasad, R.B.N. (2016). Effect of epoxidized jatropha oil on the cure, thermal, morphological and viscoelastic properties of epoxy resins. Journal of Renewable Materials, 4(2), 113-122. https://doi.org/10.7569/JRM.2015.634118
Vancouver Style
Sammaiah A, Padmaja KV, Suresh KI, Prasad RBN. Effect of epoxidized jatropha oil on the cure, thermal, morphological and viscoelastic properties of epoxy resins. J Renew Mater. 2016;4(2):113-122 https://doi.org/10.7569/JRM.2015.634118
IEEE Style
A. Sammaiah, K.V. Padmaja, K.I. Suresh, and R.B.N. Prasad, “Effect of Epoxidized Jatropha Oil on the Cure, Thermal, Morphological and Viscoelastic Properties of Epoxy Resins,” J. Renew. Mater., vol. 4, no. 2, pp. 113-122, 2016. https://doi.org/10.7569/JRM.2015.634118



cc Copyright © 2016 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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