Open Access

REVIEW

Research Progress of Soybean Protein Adhesive: A Review

Yantao Xu¹, Yufei Han¹, Jianzhang Li¹, Jing Luo², Sheldon Q. Shi³, Jingchao Li¹, Qiang Gao^1,*, An Mao^4,*

1 MOE Key Laboratory of Wooden Material Science and Application & Beijing Key Laboratory of Wood Science and Engineering, Beijing Forestry University, Beijing, 100083, China
2 College of Materials Science and Engineering, Nanjing Forestry University, Nanjing, 210037, China
3 College of Engineering Department of Mechanical and Energy Engineering, University of North Texas, Denton, 76203, USA
4 State Forestry and Grassland Administration Key Laboratory of Silviculture in Downstream Areas of the Yellow River, College of Forestry, Shandong Agricultural University, Tai’an, 271000, China

* Corresponding Authors: Qiang Gao. Email: " />; An Mao. Email: " />

(This article belongs to the Special Issue: Renewable and Biosourced Adhesives-2021)

Journal of Renewable Materials 2022, 10(10), 2519-2541. https://doi.org/10.32604/jrm.2022.020750

Received 12 December 2021; Accepted 01 March 2022; Issue published 08 June 2022

Abstract

Traditional formaldehyde-based adhesives rely excessively on petrochemical resources, release toxic gases, and pollute the environment. Plant-derived soybean protein adhesives are eco-friendly materials that have the potential to replace the formaldehyde-based adhesives used to fabricate wood-based panels. However, the poor water resistance, high brittleness, and poor mildew resistance of soybean protein adhesives limit their industrial applications. This article reviews recent research progress in the modification of soybean protein adhesives for improving the bonding performance of adhesives used for wood-based panel fabrication. Modification methods were summarized in terms of water resistance, solid content, and mildew resistance. The modification mechanisms and remaining problems were also discussed. Finally, the current industrial applications and the future research direction of soybean protein adhesives are discussed.

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