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Robust Color Fastness of Dyed Silk Fibroin Film By Coupling Modification Dyeing with Aniline Diazonium Salt

ZONGQIAN WANG, HAIWEI YANG, JIAN XING, ZHI LIU*

School of Textile and Garment, Anhui Polytechnic University, Wuhu 241000, China

* Corresponding Author: e-mail: email

Journal of Polymer Materials 2019, 36(2), 149-159. https://doi.org/10.32381/JPM.2019.36.02.4

Abstract

Colored silk fibroin (SF) film can change the proportion of transmitted light composition and therefore shows potential application in optoelectronics area. However, few methods are reported for the preparation of colored SF film with good color fastness. Herein, colored SF film was prepared by coupling modification dyeing (CM-dyeing) of SF tyrosine residues in solution. SF film shows excellent color fastness due to the formation of the azo covalent bond formed by electrophilic substitution reaction between SF tyrosine residues and aniline diazonium salt. Furthermore, compared with the undyed film, the dyed SF film is effectively preserved its mechanical property by the mild dyeing conditions (up to 99.02 % on average). Therefore, this facile method presents an alternative approach to construct colored SF film with outstanding performance and benefits its relevant applications.

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APA Style
WANG, Z., YANG, H., XING, J., LIU, Z. (2019). Robust color fastness of dyed silk fibroin film by coupling modification dyeing with aniline diazonium salt. Journal of Polymer Materials, 36(2), 149-159. https://doi.org/10.32381/JPM.2019.36.02.4
Vancouver Style
WANG Z, YANG H, XING J, LIU Z. Robust color fastness of dyed silk fibroin film by coupling modification dyeing with aniline diazonium salt. J Polym Materials . 2019;36(2):149-159 https://doi.org/10.32381/JPM.2019.36.02.4
IEEE Style
Z. WANG, H. YANG, J. XING, and Z. LIU, “Robust Color Fastness of Dyed Silk Fibroin Film By Coupling Modification Dyeing with Aniline Diazonium Salt,” J. Polym. Materials , vol. 36, no. 2, pp. 149-159, 2019. https://doi.org/10.32381/JPM.2019.36.02.4



cc Copyright © 2019 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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