In order to provide a better user experience and more convenient workflow to all users, we have developed a new submission system.

The new version is available now in the following journals: Energy Engineering, Structural Durability & Health Monitoring, Sound & Vibration, Molecular & Cellular Biomechanics.

Authors who contribute to the above journals are welcome to use the new submission system(https://ijs.tspsubmission.com). Please also note that manuscripts submitted before 27 March 2023 will still be processed by our old submission system(https://www.tspsubmission.com).

Should you have met any questions or any suggestions, do not hesitate to contact us(support@techscience.com) to make the new submission system further improved.