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ABSTRACT

Preconditioners for finite element consolidation

by G. Gambolati1, M. Ferronato1, C. Janna1

Dept. of Mathematical Methods and Models for Scientific Applications, University of Padova,Italy

The International Conference on Computational & Experimental Engineering and Sciences 2009, 9(2), 99-106. https://doi.org/10.3970/icces.2009.009.099

Abstract

The Finite Element (FE) solution to consolidation equations in large geological settings raises a few numerical issues depending on the actual process addressed by the analysis. There are two basic problems where the solver efficiency plays a crucial role: 1- fully coupled consolidation, and 2- non-linear faulted (uncoupled) consolidation. Using a proper nodal numbering the FE matrices exhibit a block (or multilevel) structure. Krylov subspace solvers are attracting a growing attention, provided that a relatively inexpensive and effective preconditioner is available. For both problems possible preconditioners include the Diagonal Scaling (DS), the Incomplete Triangular Factorization (ILU), the Mixed Constraint Preconditioning (MCP) and the Multilevel Incomplete Factorization (MIF). The present communication provides a review and a critical discussion of DS, ILU, MCP and MIF when used as preconditioners for the numerical solution of a consolidation model.

Cite This Article

APA Style
Gambolati, G., Ferronato, M., Janna, C. (2009). Preconditioners for finite element consolidation. The International Conference on Computational & Experimental Engineering and Sciences, 9(2), 99-106. https://doi.org/10.3970/icces.2009.009.099
Vancouver Style
Gambolati G, Ferronato M, Janna C. Preconditioners for finite element consolidation. Int Conf Comput Exp Eng Sciences . 2009;9(2):99-106 https://doi.org/10.3970/icces.2009.009.099
IEEE Style
G. Gambolati, M. Ferronato, and C. Janna, “Preconditioners for finite element consolidation,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 9, no. 2, pp. 99-106, 2009. https://doi.org/10.3970/icces.2009.009.099



cc Copyright © 2009 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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