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ABSTRACT

A New Equation to Determine the Springback in the Bending Process of Metallic Sheet

by Z. Damián-Noriega1, R. Pérez-Moreno1, S.A. Villanueva-Pruneda1, J.P.A. Puerta-Huerta1, C. Huerta-Muñoz3

Departamento de Energía, División de Ciencias Básicas e Ingeniería, Universidad Autónoma Metropolitana Unidad Azcapotzalco (UAM-A), San Pablo 180 Col. Reynosa Tamaulipas, Az-capotzalco D.F., México. Tel (55)5318-9072, E-mail: zdn@correo.azc.uam.mx
Laboratorio de Biomecánica, Instituto Nacional de Rehabilitación, Tlalpan D.F. México
Mechanical Engineering student, Departamento de Energía (UAM-A)

The International Conference on Computational & Experimental Engineering and Sciences 2008, 8(1), 25-30. https://doi.org/10.3970/icces.2008.008.025

Abstract

In this work, a new equation to predict the springback in the bending and rolling processes of metallic sheet is presented. This equation has been experimentally applied in the design of a wood truncated cone to form an aluminum sheet truncated cone. Kalpakjian's equation was also applied but Damian's equation has given the best performance.

Cite This Article

APA Style
Damián-Noriega, Z., Pérez-Moreno, R., Villanueva-Pruneda, S., Domínguez-Hernández, V., Puerta-Huerta, J. et al. (2008). A new equation to determine the springback in the bending process of metallic sheet. The International Conference on Computational & Experimental Engineering and Sciences, 8(1), 25-30. https://doi.org/10.3970/icces.2008.008.025
Vancouver Style
Damián-Noriega Z, Pérez-Moreno R, Villanueva-Pruneda S, Domínguez-Hernández V, Puerta-Huerta J, Huerta-Muñoz C. A new equation to determine the springback in the bending process of metallic sheet. Int Conf Comput Exp Eng Sciences . 2008;8(1):25-30 https://doi.org/10.3970/icces.2008.008.025
IEEE Style
Z. Damián-Noriega, R. Pérez-Moreno, S. Villanueva-Pruneda, V. Domínguez-Hernández, J. Puerta-Huerta, and C. Huerta-Muñoz, “A New Equation to Determine the Springback in the Bending Process of Metallic Sheet,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 8, no. 1, pp. 25-30, 2008. https://doi.org/10.3970/icces.2008.008.025



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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