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ABSTRACT

Inverse Estimation of Moisture Diffusivity by Utilizing Temperature Response of a Drying Body

G. Kanevce1, L. Kanevce2, V. Mitrevski3, G. Dulikravich4

Macedonian Academy of Sciences and Arts, Skopje, Macedonia
Faculty of Technical Sciences, St. Kliment Ohridski University, Bitola, Macedonia
Faculty of Technical Sciences, St. Kliment Ohridski University, Bitola, Macedonia
Department of Mechanical and Materials Engineering, Florida International University, 10555 West Flagler St., EC 3474, Miami, Florida 33174, USA

The International Conference on Computational & Experimental Engineering and Sciences 2008, 8(1), 1-6. https://doi.org/10.3970/icces.2008.008.001

Abstract

This paper deals with the application of inverse concepts in drying. The objective of the paper is estimation of the moisture diffusivity of a drying body by using only temperature measurements. Potato and apple slices have been chosen as representative drying bodies with significant shrinkage effects. A mathematical model of the drying process of shrinking bodies has been applied. The Levenberg-Marquardt method and a hybrid optimization method of minimization of the least-squares norm were used to solve the present parameter estimation problem.

Cite This Article

APA Style
Kanevce, G., Kanevce, L., Mitrevski, V., Dulikravich, G. (2008). Inverse estimation of moisture diffusivity by utilizing temperature response of a drying body. The International Conference on Computational & Experimental Engineering and Sciences, 8(1), 1-6. https://doi.org/10.3970/icces.2008.008.001
Vancouver Style
Kanevce G, Kanevce L, Mitrevski V, Dulikravich G. Inverse estimation of moisture diffusivity by utilizing temperature response of a drying body. Int Conf Comput Exp Eng Sciences . 2008;8(1):1-6 https://doi.org/10.3970/icces.2008.008.001
IEEE Style
G. Kanevce, L. Kanevce, V. Mitrevski, and G. Dulikravich, “Inverse Estimation of Moisture Diffusivity by Utilizing Temperature Response of a Drying Body,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 8, no. 1, pp. 1-6, 2008. https://doi.org/10.3970/icces.2008.008.001



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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