Open Access

ABSTRACT

Computational Environment for the Multiscale, Multi-Physics Resin Transfer Molding Process

B. J. Henz¹, D. R. Shires²

1 Team Member, Comp. Eng. Light-Weight Structures, U.S. Army Research Laboratory, APG, MD, USA
2 Team Leader, Comp. Eng. Light-Weight Structures, U.S. Army Research Laboratory, APG, MD, USA

The International Conference on Computational & Experimental Engineering and Sciences 2008, 7(1), 13-18. https://doi.org/10.3970/icces.2008.007.013

Abstract

The capability to predict the residual stresses induced during the manufacturing process in composite components is necessary for the timely fielding of new combat systems. At the U.S. Army Research Laboratory we have developed a computational environment to model the resin flow, heat transfer, curing, and residual stresses in composite components manufactured with the resin transfer molding (RTM) process. This computational environment uses object-oriented programming methods to provide model coupling capabilities and access to high performance computing assets. In this paper we will provide details of the physical models, software, and the validation/verification procedure used to develop this RTM simulation package.

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