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ABSTRACT

Vibro-Acoustic Prediction by Mechanical Impedance Method

SAKO Fumiko1, ADACHI Yukihiro1, SHI Qinzhong2, ANDO Shigemasa2, TSUCHIHASHI Masahiro2, HAGIWARA Ichiro3

Master, Department of Mechanichal Sciences and Engineering, Tokyo Inst. Of Tech., Japan
Japan Aerospace Exploration Agency, Japan
Department of Mechanichal Sciences and Engineering, Tokyo Inst. Of Tech., Japan

The International Conference on Computational & Experimental Engineering and Sciences 2008, 6(4), 229-232. https://doi.org/10.3970/icces.2008.006.229

Abstract

Satellite equipment experience severe high random acoustic loads during launch phase. [1\hbox {}] Accurate prediction of this random vibration is demanded to prevent equipmtnt from trouble. In this paper, a new approach for vibro-acoustic coupling analysis is proposed to obtain more accurate prediction. The proposed method applies Mechanical Impedance Method to vibro-acoustic coupling analysis with FEM model of structure and SEA model of sound system. \newline The analysis of simple model is conducted to study the proposed method. The result from the comparison shows this method provides more accurate prediction with structure impedance calculated from area-excitation analysis than from point-excitation analysis.

Cite This Article

APA Style
Fumiko, S., Yukihiro, A., Qinzhong, S., Shigemasa, A., Masahiro, T. et al. (2008). Vibro-acoustic prediction by mechanical impedance method. The International Conference on Computational & Experimental Engineering and Sciences, 6(4), 229-232. https://doi.org/10.3970/icces.2008.006.229
Vancouver Style
Fumiko S, Yukihiro A, Qinzhong S, Shigemasa A, Masahiro T, Ichiro H. Vibro-acoustic prediction by mechanical impedance method. Int Conf Comput Exp Eng Sciences . 2008;6(4):229-232 https://doi.org/10.3970/icces.2008.006.229
IEEE Style
S. Fumiko, A. Yukihiro, S. Qinzhong, A. Shigemasa, T. Masahiro, and H. Ichiro, “Vibro-Acoustic Prediction by Mechanical Impedance Method,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 6, no. 4, pp. 229-232, 2008. https://doi.org/10.3970/icces.2008.006.229



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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