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ABSTRACT

Computational Simulation of Mechanical Behavior of Semi-Crystalline Polymers with Randomly Distributed Rubber Particles

by M. Uchida1, N. Tada1, Y. Tomita2

Graduate School of Natural Science and Technology, Okayama University, Japan
Graduate School of Engineering, Kobe University, Japan

The International Conference on Computational & Experimental Engineering and Sciences 2008, 6(2), 91-98. https://doi.org/10.3970/icces.2008.006.091

Abstract

Micro- to mesoscopic deformation behavior of semi-crystalline polymer with randomly distributed rubber particles is evaluated by numerical simulation. In this model, dimension of mesostructure is identified by volume fraction of interface region around the rubber particles. The effects of strain rate and size of mesostructure on macroscopic stress-strain relation and strain distribution in mesoscopic area are discussed. In the earlier stage of deformation, the slope of stress-strain relation changes by rubber particle size while stress in the following deformation is mainly affected by the tensile strain rate. The anisotropic deformation in lamellar oriented interface region causes change in the strain distribution depending on size of mesostructure.

Cite This Article

APA Style
Uchida, M., Tada, N., Tomita, Y. (2008). Computational simulation of mechanical behavior of semi-crystalline polymers with randomly distributed rubber particles . The International Conference on Computational & Experimental Engineering and Sciences, 6(2), 91-98. https://doi.org/10.3970/icces.2008.006.091
Vancouver Style
Uchida M, Tada N, Tomita Y. Computational simulation of mechanical behavior of semi-crystalline polymers with randomly distributed rubber particles . Int Conf Comput Exp Eng Sciences . 2008;6(2):91-98 https://doi.org/10.3970/icces.2008.006.091
IEEE Style
M. Uchida, N. Tada, and Y. Tomita, “Computational Simulation of Mechanical Behavior of Semi-Crystalline Polymers with Randomly Distributed Rubber Particles ,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 6, no. 2, pp. 91-98, 2008. https://doi.org/10.3970/icces.2008.006.091



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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