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ABSTRACT

Asymptotic Mode-I Crack-tip Stress Fields for Orthotropic Graded Materials

Vijaya Bhaskar Chalivendra1

Department of Mechanical Engineering, University of Massachusetts Dartmouth, MA 02720, USA

The International Conference on Computational & Experimental Engineering and Sciences 2008, 5(1), 27-34. https://doi.org/10.3970/icces.2008.005.027

Abstract

Asymptotic analysis coupled with Westergaard stress function approach is used to develop quasi-static stress fields for a crack oriented along one of the principal axes of inhomogeneous orthotropic medium. In the formulation, four independent engineering constants, E11, E22, G12, v12 are replaced by an effective stiffness E = √E11E22, a stiffness ratio δ = (E11/E22), an effective Poisson's ratio v = √v12v21, and a shear parameter k = (E/2G12)-v. It is assumed that the effective stiffness varies exponentially along one of the principal axes of orthotropy. The first two terms in the expansion of stress field are derived to explicitly bring out the influence of nonhomogeneity on the structure of the stress field. Using the derived stress field equations, the isochromatic fringe contours are developed to understand the variation of stress field around the crack tip as a function of both orthotropic stiffness ratio and non-homogeneous coefficient.

Cite This Article

APA Style
Chalivendra, V.B. (2008). Asymptotic mode-i crack-tip stress fields for orthotropic graded materials. The International Conference on Computational & Experimental Engineering and Sciences, 5(1), 27-34. https://doi.org/10.3970/icces.2008.005.027
Vancouver Style
Chalivendra VB. Asymptotic mode-i crack-tip stress fields for orthotropic graded materials. Int Conf Comput Exp Eng Sciences . 2008;5(1):27-34 https://doi.org/10.3970/icces.2008.005.027
IEEE Style
V.B. Chalivendra, “Asymptotic Mode-I Crack-tip Stress Fields for Orthotropic Graded Materials,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 5, no. 1, pp. 27-34, 2008. https://doi.org/10.3970/icces.2008.005.027



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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