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ABSTRACT

Implicit Formulation of Homogenization Method for Periodic Inelastic Solids

by T. Asada1, N. Ohno1

Dept. of Computational Science and Engineering, Nagoya University, Nagoya, Japan

The International Conference on Computational & Experimental Engineering and Sciences 2007, 4(4), 201-206. https://doi.org/10.3970/icces.2007.004.201

Abstract

In this study, to determine incremental, perturbed displacement fields in periodic inelastic solids, an incremental homogenization problem is fully implicitly formulated, and an algorithm is developed to solve the homogenization problem. It is shown that the homogenization problem can be iteratively solved with quadratic convergences by successively updating strain increments in unit cells, and that the present formulation allows versatility in the initial setting of strain increments in contrast to previous studies. The homogenization algorithm developed is then examined by analyzing a holed plate, with an elastoplastic micro-structure, subjected to tensile loading. It is thus demonstrated that the convergence in iteratively solving the homogenization problem strongly depends on the initial setting of strain increments in unit cells, and that quick convergences can be attained if the initial setting of strain increments is appropriate.

Cite This Article

APA Style
Asada, T., Ohno, N. (2007). Implicit formulation of homogenization method for periodic inelastic solids. The International Conference on Computational & Experimental Engineering and Sciences, 4(4), 201-206. https://doi.org/10.3970/icces.2007.004.201
Vancouver Style
Asada T, Ohno N. Implicit formulation of homogenization method for periodic inelastic solids. Int Conf Comput Exp Eng Sciences . 2007;4(4):201-206 https://doi.org/10.3970/icces.2007.004.201
IEEE Style
T. Asada and N. Ohno, “Implicit Formulation of Homogenization Method for Periodic Inelastic Solids,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 4, no. 4, pp. 201-206, 2007. https://doi.org/10.3970/icces.2007.004.201



cc Copyright © 2007 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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