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FabriCast: Casting Silicone Structures via Direct Ink Writing on Textiles

J. M. Tan1, A. Chooi2, C. Chen1, A. Castillo Ugalde2, T. Stalin2, T. Calais2, P. Valdivia y Alvarado1,2,3,*

1 Singapore University of Technology and Design, Engineering and Product Development Pillar, 8 Somapah Road, Singapore, 487372, Singapore
2 Digital Manufacturing and Design Research Centre, Singapore University of Technology and Design, 8 Somapah Road, Singapore, 487372, Singapore
3 Singapore-HUJ Alliance for Research and Enterprise (SHARE), The Smart Grippers for Soft Robotics (SGSR) Programme, Campus for Research Excellence and Technological Enterprise (CREATE), Singapore, 138602, Singapore

* Corresponding Author: P. Valdivia y Alvarado. Email: email

The International Conference on Computational & Experimental Engineering and Sciences 2024, 31(3), 1-1. https://doi.org/10.32604/icces.2024.011827

Abstract

In this study two novel forms of textile-assisted direct ink writing (DIW) of room temperature vulcanised (RTV) silicones were explored: Silicone DIW on spandex fabric, and Silicone DIW on dissolvable fabrics. These processes were evaluated by incorporating resulting components into 4 soft robotic devices: impact resistant elbow pads, a soft passive suction cup gripper, and two fiber embedded inflatable tendril-like soft grippers.

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Cite This Article

APA Style
Tan, J.M., Chooi, A., Chen, C., Ugalde, A.C., Stalin, T. et al. (2024). Fabricast: casting silicone structures via direct ink writing on textiles. The International Conference on Computational & Experimental Engineering and Sciences, 31(3), 1-1. https://doi.org/10.32604/icces.2024.011827
Vancouver Style
Tan JM, Chooi A, Chen C, Ugalde AC, Stalin T, Calais T, et al. Fabricast: casting silicone structures via direct ink writing on textiles. Int Conf Comput Exp Eng Sciences . 2024;31(3):1-1 https://doi.org/10.32604/icces.2024.011827
IEEE Style
J.M. Tan et al., “FabriCast: Casting Silicone Structures via Direct Ink Writing on Textiles,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 31, no. 3, pp. 1-1, 2024. https://doi.org/10.32604/icces.2024.011827



cc Copyright © 2024 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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