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Formation of Horizontal Dislocation Wall in Metals During Tribology

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1 School of Metallurgical Engineering, Anhui University of Technology, Maanshan, 243002, China

* Corresponding Author: Wenzhen Xia. Email: email

The International Conference on Computational & Experimental Engineering and Sciences 2023, 27(3), 1-1. https://doi.org/10.32604/icces.2023.09758

Abstract

Microstructural alteration of tribo-elements' the near-surface region significantly affects how long a tribosystem will last. To design and tailor future surfaces of tribo-elements, a fundamental understanding of microstructure evolution under local tribological exposure is required. During the initial steps of macrotribological process in metals, horizontal dislocation walls have been observed, which later develop into the grain-refined tribolayer, however, their fundamental mechanisms are yet unknown. In this work, we developed a novel micro-tribological test, in order to directly inspect the contact zone and simplify the stress status. Our preliminary basic tribological experiments identify grain orientation and twin boundary effects in dry environment, and depict the microscale formation mechanism of a horizontal dislocation wall during the tribological process. This fundamental microscale research can enhance our comprehension of macroscale tribology and offer suggestions for lowering replacement prices, noise levels, and energy usage in dry environment.

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Cite This Article

APA Style
Xia, W. (2023). Formation of horizontal dislocation wall in metals during tribology. The International Conference on Computational & Experimental Engineering and Sciences, 27(3), 1-1. https://doi.org/10.32604/icces.2023.09758
Vancouver Style
Xia W. Formation of horizontal dislocation wall in metals during tribology. Int Conf Comput Exp Eng Sciences . 2023;27(3):1-1 https://doi.org/10.32604/icces.2023.09758
IEEE Style
W. Xia, “Formation of Horizontal Dislocation Wall in Metals During Tribology,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 27, no. 3, pp. 1-1, 2023. https://doi.org/10.32604/icces.2023.09758



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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