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Numerical Analysis of Supercritical CO2 Flow and Heat Transfer Inside Porous Structures on a Microchip

Mengshuai Chen1,2, Karim Ragui1, Lin Chen1,2,3,*

1 Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing, 100190, China
2 University of Chinese Academy of Sciences, Beijing, 100049, China
3 Innovation Academy for Light-Duty Gas Turbine, Chinese Academy of Sciences, Beijing, 100190, China

* Corresponding Author: Lin Chen. Email: email

The International Conference on Computational & Experimental Engineering and Sciences 2023, 26(4), 1-2. https://doi.org/10.32604/icces.2023.09526

Abstract

With the development of supercritical fluid technology, supercritical CO2 has great applications in carbon sequestration, soil remediation, recovery of petroleum gas, material extraction in industrial processes, and product pure drug nanoparticles/nanocrystals. In these applications, the flow and heat transfer, phase change of sCO2 in porous media are involved. Combined with the previous research methods, we establish a three-dimensional microchannel chip porous media model. Using the numerical simulation method, we study the flow and heat transfer characteristics of sCO2 in the microchannel chip porous media under different working conditions. The temperature, pressure and density distribution are obtained under different working conditions. We also investigate the influence of inlet conditions such as mass flow and inlet temperature on pressure drop between inlet and outlet of porous media model and heat transfer coefficient between CO2 and heating wall of microchannel chip. The results show that the increase of mass flow rate and inlet temperature will increase the pressure drop, while the increase of outlet pressure will decrease the pressure drop. The increase of mass flow will enhance heat transfer, while when the inlet temperature exceeds the critical temperature of CO2, the increase of inlet temperature will inhibit heat transfer. The variation of heat transfer coefficient in different regions of the numerical model is also observed.

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APA Style
Chen, M., Ragui, K., Chen, L. (2023). Numerical analysis of supercritical co2 flow and heat transfer inside porous structures on a microchip. The International Conference on Computational & Experimental Engineering and Sciences, 26(4), 1-2. https://doi.org/10.32604/icces.2023.09526
Vancouver Style
Chen M, Ragui K, Chen L. Numerical analysis of supercritical co2 flow and heat transfer inside porous structures on a microchip. Int Conf Comput Exp Eng Sciences . 2023;26(4):1-2 https://doi.org/10.32604/icces.2023.09526
IEEE Style
M. Chen, K. Ragui, and L. Chen, “Numerical Analysis of Supercritical CO2 Flow and Heat Transfer Inside Porous Structures on a Microchip,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 26, no. 4, pp. 1-2, 2023. https://doi.org/10.32604/icces.2023.09526



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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