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Home/ Journals/ ICCES/ Vol.19, No.2, 2011/ 10.3970/icces.2011.019.057

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ABSTRACT

Hygro-Thermal Behaviors of an ACF-typed Ultra-thin Chip-on-Flex Interconnect Technology

Hsien-Chie Cheng, Ho-hsiang Huang, Su-Tsai Lu, Wen-Hwa Chen

TSP_ICCES_57.pdf

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