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ABSTRACT

Quasi-static studies of deformation, fracture and mechanical properties of a PBX simulant using digital image correlation method

Zhongbin Zhou, Pengwan Chen, Fenglei Huang

The International Conference on Computational & Experimental Engineering and Sciences 2011, 17(4), 125-126. https://doi.org/10.3970/icces.2011.017.125

Abstract

The macroscopic deformation and fracture behavior of a polymer bonded explosive (PBX) simulation material were studied by using Digital Image Correlation (DIC) method. The Brazilian test, semi-circular bending test, punch loading and uniaxial loading experiments were chosen for the study. The whole displacement and strain fields were obtained by using DIC method at macro-scale. New sights into fracture processes and failure mechanisms of simulant samples under different quasi-static loading conditions have been obtained. Macro studies show that the experimental results are in agreement with the theoretical analysis. The experimental methods combined with DIC technique have broad applicability to deformation and fracture studies of a variety of composites.

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APA Style
Zhou, Z., Chen, P., Huang, F. (2011). Quasi-static studies of deformation, fracture and mechanical properties of a PBX simulant using digital image correlation method. The International Conference on Computational & Experimental Engineering and Sciences, 17(4), 125-126. https://doi.org/10.3970/icces.2011.017.125
Vancouver Style
Zhou Z, Chen P, Huang F. Quasi-static studies of deformation, fracture and mechanical properties of a PBX simulant using digital image correlation method. Int Conf Comput Exp Eng Sciences . 2011;17(4):125-126 https://doi.org/10.3970/icces.2011.017.125
IEEE Style
Z. Zhou, P. Chen, and F. Huang, “Quasi-static studies of deformation, fracture and mechanical properties of a PBX simulant using digital image correlation method,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 17, no. 4, pp. 125-126, 2011. https://doi.org/10.3970/icces.2011.017.125



cc Copyright © 2011 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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