Open Access
ABSTRACT
Calculating strains from noisy displacement fields by a finite element technique
The International Conference on Computational & Experimental Engineering and Sciences 2011, 17(4), 115-116. https://doi.org/10.3970/icces.2011.017.115
Abstract
Optical full-field measurement methods are now widely applied in various domains. In general, the displacement fields can be directly obtained from the measurement; however in mechanical analysis strain fields are preferred. To extract strain fields from noisy displacement fields is always a challenging topic. In this study, a finite element method for smoothing displacement fields and calculating strain fields is proposed. An experimental test case on a holed aluminum specimen under tension is applied to validate this method. The heterogeneous displacement fields of the area around the hole are measured by the digital image correlation (DIC). By our proposed method, the smoothed displacement fields and strain fields are obtained. The result shows that the measuring noise on experimental displacement fields can be successfully removed, and strain fields can be reconstructed in the arbitrary area.Cite This Article
APA Style
Baoqiao, G., Pengwan, C., Qingming, Z., Yanjie, L., Huimin, X. (2011). Calculating strains from noisy displacement fields by a finite element technique. The International Conference on Computational & Experimental Engineering and Sciences, 17(4), 115-116. https://doi.org/10.3970/icces.2011.017.115
Vancouver Style
Baoqiao G, Pengwan C, Qingming Z, Yanjie L, Huimin X. Calculating strains from noisy displacement fields by a finite element technique. Int Conf Comput Exp Eng Sciences . 2011;17(4):115-116 https://doi.org/10.3970/icces.2011.017.115
IEEE Style
G. Baoqiao, C. Pengwan, Z. Qingming, L. Yanjie, and X. Huimin, “Calculating strains from noisy displacement fields by a finite element technique,” Int. Conf. Comput. Exp. Eng. Sciences , vol. 17, no. 4, pp. 115-116, 2011. https://doi.org/10.3970/icces.2011.017.115
Copyright © 2011 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.