Open Access

ABSTRACT

Experimental/numerical analysis on the thermal-induced warpage of ultra-thin chip-on-flex (UTCOF) interconnects

Su-Tsai Lu^1,2, Wen-Hwa Chen¹

1 Dept. of Power Mechanical Engineering, National TsingHua University, Taiwan, R.O.C.
2 Electronics and Optoelectronics Research Laboratories, ITRI, Taiwan, R.O.C. Email: kirkirlu@itri.org.tw