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A Substrate Integrated Waveguide Based Filtenna for X and Ku Band Application

S. Leo Pauline1,*, T. R. GaneshBabu2

1 Veltech Multitech Dr. RR & Dr. SR Engineering College, Chennai, India
2 Muthayammal Engineering College, Rasipuram, Namakkal, India

* Corresponding Author: S. Leo Pauline. Email:

Intelligent Automation & Soft Computing 2023, 35(1), 465-473.


In this paper Substrate Integrated Waveguide-based filtenna operating at Ku band is proposed. The model is designed on a low loss dielectric substrate having a thickness of 0.508 mm and comprises of shorting vias along two edges of the substrate walls. To realize a bandpass filter, secondary shorting vias are placed close to primary shorting vias. The dimension and position of the vias are carefully analyzed for Ku band frequencies. The model is fabricated on Roger RT/duroid 5880 and the performance characteristics are measured. The proposed model achieves significant impedance characteristics with wider bandwidth in the Ku band. The model also achieves a maximum gain of 7.46 dBi in the operating band thus making it suitable for Ku-band applications. Substrate Integrated Waveguide (SIW) Structures possess most of the advantages over conventional radiofrequency waveguides since they have high power management capacity with self-consistent electrical shielding. The most noteworthy advantage of SIW, it can able to integrate all the components on the same substrate, both passive and active components.


Cite This Article

S. Leo Pauline and T. R. GaneshBabu, "A substrate integrated waveguide based filtenna for x and ku band application," Intelligent Automation & Soft Computing, vol. 35, no.1, pp. 465–473, 2023.

This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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