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NUMERICAL STUDY OF THE GASKET THERMAL CONDUCTIVITY EFFECT ON THE THERMAL CONTACT RESISTANCE BETWEEN TWO SOLIDS IN CONTACT

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a Aix Marseille University, CNRS, Centrale Marseille, LMA, UPR 7051, Marseille, France
b Mechanical Engineering Department, Faculty of Technology, Djillali Liabes University Sidi Bel Abbes 22000 Algeria

* Corresponding Author: Email: chadouli @lma.cnrs-mrs.fr

Frontiers in Heat and Mass Transfer 2017, 8, 1-6. https://doi.org/10.5098/hmt.8.30

Abstract

In this paper, a numerical model investigating the impact of gasket thermal quality on the reduction in the thermal contact resistance (TCR) between two solids is presented and validated analytically. The model proposed is a 2D steady state model. The thermal conductivity of the solid materials ranges from 20 to 390 W/m·K, and the gasket thermal conductivity ranges from 0.16W/m·K (TC of rubber) to and 5W/m·K (TC of thermal paste). As expected, the results obtained clearly confirm that the gasket significantly improves the heat transfer between two solids in contact, and in particular that the TCR is decreased with increasing gasket thermal conductivity. The numerical results are validated by an analytical model which shows that the gasket has a crucial effect on the heat transfer enhancement between the solids in contact.

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APA Style
Chadouli, R., Lebon, F., Rosu, I., Makhlouf, M. (2017). NUMERICAL STUDY OF THE GASKET THERMAL CONDUCTIVITY EFFECT ON THE THERMAL CONTACT RESISTANCE BETWEEN TWO SOLIDS IN CONTACT. Frontiers in Heat and Mass Transfer, 8(1), 1-6. https://doi.org/10.5098/hmt.8.30
Vancouver Style
Chadouli R, Lebon F, Rosu I, Makhlouf M. NUMERICAL STUDY OF THE GASKET THERMAL CONDUCTIVITY EFFECT ON THE THERMAL CONTACT RESISTANCE BETWEEN TWO SOLIDS IN CONTACT. Front Heat Mass Transf. 2017;8(1):1-6 https://doi.org/10.5098/hmt.8.30
IEEE Style
R. Chadouli, F. Lebon, I. Rosu, and M. Makhlouf, “NUMERICAL STUDY OF THE GASKET THERMAL CONDUCTIVITY EFFECT ON THE THERMAL CONTACT RESISTANCE BETWEEN TWO SOLIDS IN CONTACT,” Front. Heat Mass Transf., vol. 8, no. 1, pp. 1-6, 2017. https://doi.org/10.5098/hmt.8.30



cc Copyright © 2017 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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