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NUMERICAL SIMULATION OF FLUID FLOW AND HEAT TRANSFER IN A MEMS-BASED MICRO CHANNEL HEAT SINK

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a School of Engineering Science, Simon Fraser University, BC, Canada V3T 0A3
b Bangladesh University of Engineering & Technology (BUET), Dhaka, 1000, Bangladesh

* Corresponding Author: E-mail: email

Frontiers in Heat and Mass Transfer 2012, 3(3), 1-8. https://doi.org/10.5098/hmt.v3.3.3002

Abstract

Carbon nanotube (CNT) has been proven to be an effective material for the thermal management of MEMS-based devices due to its superior thermal conductivity. At the same time, micro-channel heat-sinks are widely used in electronic products as a high performance heat transfer device because of its simple construction, easy fabrication process and effective heat removal capability. A numerical study has been carried out to investigate the thermal-fluid characteristics of the aligned and staggered MWCNT (multi walled CNT) based micro pin fins having 650 µm long with hydraulic diameter of ~130 µm. Average heat transfer coefficients have been obtained for effective heat fluxes ranging from 50 to 130 W and Reynolds numbers from 14 to 160. The influence of various fluids, fluid velocity; fluid conductivity, fin material, fin conductivity, fin geometry and fin orientations on cooling effects have also been investigated and compared in this study.

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APA Style
Ismail, M.F., Rashid, M., Mahbub, M. (2012). NUMERICAL SIMULATION OF FLUID FLOW AND HEAT TRANSFER IN A MEMS-BASED MICRO CHANNEL HEAT SINK. Frontiers in Heat and Mass Transfer, 3(3), 1-8. https://doi.org/10.5098/hmt.v3.3.3002
Vancouver Style
Ismail MF, Rashid M, Mahbub M. NUMERICAL SIMULATION OF FLUID FLOW AND HEAT TRANSFER IN A MEMS-BASED MICRO CHANNEL HEAT SINK. Front Heat Mass Transf. 2012;3(3):1-8 https://doi.org/10.5098/hmt.v3.3.3002
IEEE Style
M.F. Ismail, M. Rashid, and M. Mahbub, “NUMERICAL SIMULATION OF FLUID FLOW AND HEAT TRANSFER IN A MEMS-BASED MICRO CHANNEL HEAT SINK,” Front. Heat Mass Transf., vol. 3, no. 3, pp. 1-8, 2012. https://doi.org/10.5098/hmt.v3.3.3002



cc Copyright © 2012 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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