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REDUCING HEAT TRANSFER BETWEEN TWO CONCENTRIC SEMICYLINDERS USING RADIATION SHIELDS WITH TEMPERATUREDEPENDENT EMISSIVITY

Seyfolah Saedodin, M.S. Motaghedi Barforoush, Mohsen Torabi*

Department of Mechanical Engineering, Faculty of Engineering, Semnan University, Semnan, Iran

* Corresponding Author: Tel: +9891-28103473, E-mail: email

Frontiers in Heat and Mass Transfer 2011, 2(4), 1-4. https://doi.org/10.5098/hmt.v2.4.4001

Abstract

In this paper, a simplifying approach for calculating the radiant energy is achieved using the concept of net radiation heat transfer and provides an easy way for solving a variety of situations. This method has been applied to calculate the net radiation heat transfer between two long concentric semi-cylinders. Then this method used to calculate reduction heat transfer when radiation shields with temperature-dependent emissivity applied between these objects. Moreover, using this method the percentage reduction in heat transfer between two surfaces was calculated. The findings reveal that, one radiation shield with lower emissivity can reduce the net heat transfer even better than two radiation shields with higher emissivity. Moreover, it can be concluded that for silicon carbide radiation shield in the range of assumed temperatures, the emissivity is almost constant.

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APA Style
Saedodin, S., Barforoush, M.M., Torabi, M. (2011). REDUCING HEAT TRANSFER BETWEEN TWO CONCENTRIC SEMICYLINDERS USING RADIATION SHIELDS WITH TEMPERATUREDEPENDENT EMISSIVITY. Frontiers in Heat and Mass Transfer, 2(4), 1-4. https://doi.org/10.5098/hmt.v2.4.4001
Vancouver Style
Saedodin S, Barforoush MM, Torabi M. REDUCING HEAT TRANSFER BETWEEN TWO CONCENTRIC SEMICYLINDERS USING RADIATION SHIELDS WITH TEMPERATUREDEPENDENT EMISSIVITY. Front Heat Mass Transf. 2011;2(4):1-4 https://doi.org/10.5098/hmt.v2.4.4001
IEEE Style
S. Saedodin, M.M. Barforoush, and M. Torabi, “REDUCING HEAT TRANSFER BETWEEN TWO CONCENTRIC SEMICYLINDERS USING RADIATION SHIELDS WITH TEMPERATUREDEPENDENT EMISSIVITY,” Front. Heat Mass Transf., vol. 2, no. 4, pp. 1-4, 2011. https://doi.org/10.5098/hmt.v2.4.4001



cc Copyright © 2011 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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