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SATURATED AND SUBCOOLED POOL BOILING OF HFE-7200 MIXTURES ON A COPPER NANOWIRE SURFACE

Aravind Sathyanarayanaa, Pramod Warrierb, Yogendra Joshia,*, Amyn Tejab

a G.W.Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA
b School of Chemical & Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA

* Corresponding Author: Email: email

Frontiers in Heat and Mass Transfer 2011, 2(4), 1-7. https://doi.org/10.5098/hmt.v2.4.3007

Abstract

Electrical and chemical compatibility requirements of electronic components pose significant constraints on the choice of liquid coolants. Dielectric coolants such as Novec fluids and fluoroinerts are plagued by poor thermal properties. This necessitates the development of new heat transfer fluids. In this study we examine mixture formulations that provide an avenue for enhancing the properties of existing heat transfer fluids. Mixture formulations of Novec fluid (HFE 7200) with Methanol and Ethoxybutane are considered. Pool boiling experiments are performed on a copper nanowire surface. The results show an improvement of 24% and 11% in the CHF of HFE 7200 – Methanol and HFE 7200 - Ethoxybutane mixtures respectively, when compared to pure HFE 7200 at saturation condition. The mixtures also showed an enhancement in the CHF at subcooled conditions.

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APA Style
Sathyanarayana, A., Warrier, P., Joshi, Y., Teja, A. (2011). SATURATED AND SUBCOOLED POOL BOILING OF HFE-7200 MIXTURES ON A COPPER NANOWIRE SURFACE. Frontiers in Heat and Mass Transfer, 2(4), 1-7. https://doi.org/10.5098/hmt.v2.4.3007
Vancouver Style
Sathyanarayana A, Warrier P, Joshi Y, Teja A. SATURATED AND SUBCOOLED POOL BOILING OF HFE-7200 MIXTURES ON A COPPER NANOWIRE SURFACE. Front Heat Mass Transf. 2011;2(4):1-7 https://doi.org/10.5098/hmt.v2.4.3007
IEEE Style
A. Sathyanarayana, P. Warrier, Y. Joshi, and A. Teja, “SATURATED AND SUBCOOLED POOL BOILING OF HFE-7200 MIXTURES ON A COPPER NANOWIRE SURFACE,” Front. Heat Mass Transf., vol. 2, no. 4, pp. 1-7, 2011. https://doi.org/10.5098/hmt.v2.4.3007



cc Copyright © 2011 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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