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NUMERICAL SIMULATION OF DROPLET IMPACT AND SOLIDIFICATION INCLUDING THERMAL SHRINKAGE IN A THERMAL SPRAY PROCESS

Sina Alavi, Mohammad Passandideh-Fard*

Department of Mechanical Engineering, Ferdowsi University of Mashhad, Mashhad, Iran

* Corresponding Author: Associate Professor, Email: email

Frontiers in Heat and Mass Transfer 2011, 2(2), 1-9. https://doi.org/10.5098/hmt.v2.2.3007

Abstract

In this paper, a numerical study is performed to investigate the effects of thermal shrinkage on the deposition of molten particles on a substrate in a thermal spray process using the Volume-of-Fluid (VOF) method. Thermal shrinkage is a phenomenon caused by the variation of density during cooling and solidification of a molten metal. The Navier-Stokes equations along with the energy equation including phase change are solved using a 2D/axisymmetric mesh. The VOF method is used to track the free surface of molten particles, and an enthalpy-porosity formulation is used to model solidification. For the normal impact of tin particles in the order of 2 mm in diameter and 1 m/s in impact velocity, the final splat had a single cavity inside due to shrinkage. For cases with the scales of a typical thermal spray process, the effect of shrinkage appeared as a reduction in the droplet splashing on the substrate.

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APA Style
Alavi, S., Passandideh-Fard, M. (2011). NUMERICAL SIMULATION OF DROPLET IMPACT AND SOLIDIFICATION INCLUDING THERMAL SHRINKAGE IN A THERMAL SPRAY PROCESS. Frontiers in Heat and Mass Transfer, 2(2), 1-9. https://doi.org/10.5098/hmt.v2.2.3007
Vancouver Style
Alavi S, Passandideh-Fard M. NUMERICAL SIMULATION OF DROPLET IMPACT AND SOLIDIFICATION INCLUDING THERMAL SHRINKAGE IN A THERMAL SPRAY PROCESS. Front Heat Mass Transf. 2011;2(2):1-9 https://doi.org/10.5098/hmt.v2.2.3007
IEEE Style
S. Alavi and M. Passandideh-Fard, “NUMERICAL SIMULATION OF DROPLET IMPACT AND SOLIDIFICATION INCLUDING THERMAL SHRINKAGE IN A THERMAL SPRAY PROCESS,” Front. Heat Mass Transf., vol. 2, no. 2, pp. 1-9, 2011. https://doi.org/10.5098/hmt.v2.2.3007



cc Copyright © 2011 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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