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AN AXISYMMETRIC MODEL FOR SOLID-LIQUID-VAPOR PHASE CHANGE IN THIN METAL FILMS INDUCED BY AN ULTRASHORT LASER PULSE

Jing Huang, Kapil Baheti, J. K. Chen*, Yuwen Zhang

Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65201, USA

* Corresponding Author: Email: email

Frontiers in Heat and Mass Transfer 2011, 2(1), 1-10. https://doi.org/10.5098/hmt.v2.1.3005

Abstract

An axisymmetric model for thermal transport in thin metal films irradiated by an ultrashort laser pulse was developed. The superheating phenomena including preheating, melting, vaporization and re-solidification were modeled and analyzed. Together with the energy balance, nucleation dynamics was employed iteratively to track the solid-liquid interface and the gas kinetics law was used iteratively to track the liquid-vapor interface. The numerical results showed that higher laser fluence and shorter pulse width lead to higher interfacial temperature, larger melting and ablation depths. A simplified 1-D model could overestimate temperature response and ablation depth due to the omission of radial heat conduction.

Keywords

femtosecond laser; phase change; axisymmetric model.

Cite This Article

APA Style
Huang, J., Baheti, K., Chen, J.K., Zhang, Y. (2011). AN AXISYMMETRIC MODEL FOR SOLID-LIQUID-VAPOR PHASE CHANGE IN THIN METAL FILMS INDUCED BY AN ULTRASHORT LASER PULSE. Frontiers in Heat and Mass Transfer, 2(1), 1–10. https://doi.org/10.5098/hmt.v2.1.3005
Vancouver Style
Huang J, Baheti K, Chen JK, Zhang Y. AN AXISYMMETRIC MODEL FOR SOLID-LIQUID-VAPOR PHASE CHANGE IN THIN METAL FILMS INDUCED BY AN ULTRASHORT LASER PULSE. Front Heat Mass Transf. 2011;2(1):1–10. https://doi.org/10.5098/hmt.v2.1.3005
IEEE Style
J. Huang, K. Baheti, J.K. Chen, and Y. Zhang, “AN AXISYMMETRIC MODEL FOR SOLID-LIQUID-VAPOR PHASE CHANGE IN THIN METAL FILMS INDUCED BY AN ULTRASHORT LASER PULSE,” Front. Heat Mass Transf., vol. 2, no. 1, pp. 1–10, 2011. https://doi.org/10.5098/hmt.v2.1.3005



cc Copyright © 2011 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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