Open Access
ARTICLE
HOT WATER COOLED HEAT SINKS FOR EFFICIENT DATA CENTER COOLING: TOWARDS ELECTRONIC COOLING WITH HIGH EXERGETIC UTILITY
a
Laboratory of Thermodynamics in Emerging Technologies, ETH Zurich, 8092 Zurich, Switzerland
b Advanced Thermal Packaging, IBM Zurich Research Laboratory, 8803 Rueschlikon, Switzerland
* Corresponding Author: Email: , Ph.: +41 44 632 2738, Fax: +41 44 632 11 76