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A COMPREHENSIVE REVIEW ON MICROCHANNEL HEAT EXCHANGERS, HEAT SINK, AND POLYMER HEAT EXCHANGERS: CURRENT STATE OF THE ART

Vikas Gulia, Anirban Sur*

Symbiosis Institute of Technology, Symbiosis International (Deemed University), Pune-41215, Maharashtra, India
* Associate Professor Symbiosis Institute of Technology Pune-41215, Maharashtra, India
† Corresponding author: Email: anirban.sur@sitpune.edu.in

Frontiers in Heat and Mass Transfer 2022, 18, 1-10. https://doi.org/10.5098/hmt.18.40

Abstract

Over the past few decades, the world is moving towards miniature products owing to the technological developments in variegated industrial domains such as aerospace, biomedical, electronics, etc. This has led to the exponential growth of efficient micro cooling systems which are light in weight and have effective thermal performance. Microchannel Heat Sinks and Microchannel Heat Exchangers are the widely adopted solutions for such efficient micro cooling systems. This paper comprehensively reviews the recent developments in the field of Microchannel Heat Sinks and Microchannel Heat Exchangers. Initially, the concept of microchannel cooling is discussed. Further, a comprehensive review of materials, fabrication methods, experimental investigation, and numerical analysis is presented.

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APA Style
Gulia, V., Sur, A. (2022). A COMPREHENSIVE REVIEW ON MICROCHANNEL HEAT EXCHANGERS, HEAT SINK, AND POLYMER HEAT EXCHANGERS: CURRENT STATE OF THE ART. Frontiers in Heat and Mass Transfer, 18(1), 1-10. https://doi.org/10.5098/hmt.18.40
Vancouver Style
Gulia V, Sur A. A COMPREHENSIVE REVIEW ON MICROCHANNEL HEAT EXCHANGERS, HEAT SINK, AND POLYMER HEAT EXCHANGERS: CURRENT STATE OF THE ART. Front Heat Mass Transf. 2022;18(1):1-10 https://doi.org/10.5098/hmt.18.40
IEEE Style
V. Gulia and A. Sur, “A COMPREHENSIVE REVIEW ON MICROCHANNEL HEAT EXCHANGERS, HEAT SINK, AND POLYMER HEAT EXCHANGERS: CURRENT STATE OF THE ART,” Front. Heat Mass Transf., vol. 18, no. 1, pp. 1-10, 2022. https://doi.org/10.5098/hmt.18.40



cc Copyright © 2022 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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