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NUMERICAL INVESTIGATION OF FLOW AND HEAT TRANSFER IN CORRUGATED PARALLEL CHANNEL WITH SINUSOIDAL WAVE SURFACE

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a School of Mechanical Engineering, Lanzhou Jiaotong University, Lanzhou, Gansu, 730070, China
b Key Laboratory of Railway Vehicle Thermal Engineering of MOE, Lanzhou Jiaotong University, Lanzhou, Gansu, 730070, China
* Corresponding author. Email: zhangkun52015@163.com

Frontiers in Heat and Mass Transfer 2021, 17, 1-6. https://doi.org/10.5098/hmt.17.14

Abstract

Detailed numerical analysis is presented for flow and heat transfer in sinusoidal-corrugated parallel channel with six discrete heat sources placed under the bottom surface. Three dimensional numerical model are applied for simulating the flow and heat transfer process and the Colburn j factor is applied to evaluate the overall performance of the corrugated liquid cooled channel. The results show that the maximum temperature in the middle section decreases and the pressure loss increases as the wavelength of sinusoidal surface on the bottom decreases, while the increasing wave amplitude of corrugated surface can enhance the heat transfer rate in the ranges of inlet velocity from 1.5m/s to 3.5m/s. In addition, the corrugated channel have helped to improve heat transfer rate when it is compared with the traditional parallel channel.

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APA Style
Zhang, J., Zhang, K. (2021). NUMERICAL INVESTIGATION OF FLOW AND HEAT TRANSFER IN CORRUGATED PARALLEL CHANNEL WITH SINUSOIDAL WAVE SURFACE. Frontiers in Heat and Mass Transfer, 17(1), 1-6. https://doi.org/10.5098/hmt.17.14
Vancouver Style
Zhang J, Zhang K. NUMERICAL INVESTIGATION OF FLOW AND HEAT TRANSFER IN CORRUGATED PARALLEL CHANNEL WITH SINUSOIDAL WAVE SURFACE. Front Heat Mass Transf. 2021;17(1):1-6 https://doi.org/10.5098/hmt.17.14
IEEE Style
J. Zhang and K. Zhang, “NUMERICAL INVESTIGATION OF FLOW AND HEAT TRANSFER IN CORRUGATED PARALLEL CHANNEL WITH SINUSOIDAL WAVE SURFACE,” Front. Heat Mass Transf., vol. 17, no. 1, pp. 1-6, 2021. https://doi.org/10.5098/hmt.17.14



cc Copyright © 2021 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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