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NUMERICAL SIMULATION OF SLIP INFLUENCE ON ELECTRIC CONDUCTING VISCOELASTIC FLUID PAST AN ISOTHERMAL CYLINDER

CH. Amanullaa,b,*, N. Nagendrab , M. Suryanarayana Reddyc

a Department of Mathematics, Jawaharlal Nehru Technological University, Anantapur, Anantapuramu-515002, India.
b Department of Mathematics, Madanapalle Institute of Technology and Science, Madanapalle-517325, India.
c Department of Mathematics, JNTUA College of Engineering, Pulivendula-516390, Andhra Pradesh, India.

* Corresponding Author: Email: email

Frontiers in Heat and Mass Transfer 2018, 10, 1-13. https://doi.org/10.5098/hmt.10.10

Abstract

The present study deals with the computational analysis on an electrically conducting magneto viscoelastic fluid over a circular cylinder. Prescribed partial slip effects are also taken into account. The governing physical problem is tackled numerically by using the highly efficient and reliable Keller box algorithm. Impact of sundry physical parameters on physical quantities of interest are evaluated. The influence of Williamson viscoelastic fluid parameter, magnetic body force parameter, Thermal and velocity (hydrodynamic) slip parameters, stream wise variable and Prandtl number on thermos-fluid characteristics are studied graphically. The model is relevant to the simulation of magnetic polymer materials processing.

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APA Style
Amanulla, C., Nagendra, N., Reddy, M.S. (2018). NUMERICAL SIMULATION OF SLIP INFLUENCE ON ELECTRIC CONDUCTING VISCOELASTIC FLUID PAST AN ISOTHERMAL CYLINDER. Frontiers in Heat and Mass Transfer, 10(1), 1-13. https://doi.org/10.5098/hmt.10.10
Vancouver Style
Amanulla C, Nagendra N, Reddy MS. NUMERICAL SIMULATION OF SLIP INFLUENCE ON ELECTRIC CONDUCTING VISCOELASTIC FLUID PAST AN ISOTHERMAL CYLINDER. Front Heat Mass Transf. 2018;10(1):1-13 https://doi.org/10.5098/hmt.10.10
IEEE Style
C. Amanulla, N. Nagendra, and M.S. Reddy, “NUMERICAL SIMULATION OF SLIP INFLUENCE ON ELECTRIC CONDUCTING VISCOELASTIC FLUID PAST AN ISOTHERMAL CYLINDER,” Front. Heat Mass Transf., vol. 10, no. 1, pp. 1-13, 2018. https://doi.org/10.5098/hmt.10.10



cc Copyright © 2018 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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