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RADIATION AND DUFOUR EFFECTS ON LAMINAR FLOW OF A ROTATING FLUID PAST A POROUS PLATE IN CONDUCTING FIELD

N. Ananda Reddya,*, P. Chandra Reddya , M.C. Rajua , S.V.K.Varmab

a Department of Mathematics, Annamacharya Institute of Technology and Sciences (Autonomous), Rajampet-516126, A.P., India.
b Department of Mathematics, S.V. University, Tirupati – 517502, A.P., India.

* Corresponding Author: Email: email

Frontiers in Heat and Mass Transfer 2018, 10, 1-7. https://doi.org/10.5098/hmt.10.4

Abstract

A theoretical investigation has been performed to describe the laminar flow of a rotating fluid past a porous plate in conducting field with variable temperature and variable concentration taking into account the chemical reaction, radiation and Dufour effects. The non-dimensional governing equations are solved numerically by using finite difference scheme. The effects of different physical parameters on velocity, temperature and concentration are presented and discussed with the help of graphs. Also the numerical values for local skin friction, Nusselt number and Sherwood number are recorded and analyzed. Increasing values of heat source parameter results in rising of the temperature, but it falls down in the case of heat sink parameter.

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APA Style
Reddy, N.A., Reddy, P.C., Raju, M., S.V.K.Varma, (2018). RADIATION AND DUFOUR EFFECTS ON LAMINAR FLOW OF A ROTATING FLUID PAST A POROUS PLATE IN CONDUCTING FIELD. Frontiers in Heat and Mass Transfer, 10(1), 1-7. https://doi.org/10.5098/hmt.10.4
Vancouver Style
Reddy NA, Reddy PC, Raju M, S.V.K.Varma . RADIATION AND DUFOUR EFFECTS ON LAMINAR FLOW OF A ROTATING FLUID PAST A POROUS PLATE IN CONDUCTING FIELD. Front Heat Mass Transf. 2018;10(1):1-7 https://doi.org/10.5098/hmt.10.4
IEEE Style
N.A. Reddy, P.C. Reddy, M. Raju, and S.V.K.Varma, “RADIATION AND DUFOUR EFFECTS ON LAMINAR FLOW OF A ROTATING FLUID PAST A POROUS PLATE IN CONDUCTING FIELD,” Front. Heat Mass Transf., vol. 10, no. 1, pp. 1-7, 2018. https://doi.org/10.5098/hmt.10.4



cc Copyright © 2018 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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