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MHD VISCOUS CASSONFLUID FLOW IN THE PRESENCE OF A TEMPERATURE GRADIENT DEPENDENT HEAT SINK WITH PRESCRIBED HEAT AND MASS FLUX

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1 Department of Mathematics, Sri Krishna College of Technology, Coimbatore-642042, Tamil Nadu, India
2 Department of Mathematics, P. A. College of Engineering and Technology, Coimbatore-642002, Tamil Nadu, India

* Corresponding Author: Email: email

Frontiers in Heat and Mass Transfer 2018, 10, 1-10. https://doi.org/10.5098/hmt.10.1

Abstract

This paper investigates heat and mass transfer of a MHD Casson fluid over a permeable stretching surface in the presence of a temperature gradient heat sink. The effects of viscous dissipation, thermal radiation and chemical reaction are also taken into the consideration. The relevant similarity transformations are used to reduce the governing equations into a system of nonlinear ordinary differential equations and then solved analytically. The influence of various physical parameters on the velocity, temperature, concentration, skin friction coefficient, Nusselt and Sherwood numbers are investigated. The numerical results of skin friction factor, Nusselt and Sherwood number are compared with the previously published data for special cases and are found to be in good agreement.

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APA Style
Palaniammal, S., Saritha, K. (2018). MHD VISCOUS CASSONFLUID FLOW IN THE PRESENCE OF A TEMPERATURE GRADIENT DEPENDENT HEAT SINK WITH PRESCRIBED HEAT AND MASS FLUX. Frontiers in Heat and Mass Transfer, 10(1), 1-10. https://doi.org/10.5098/hmt.10.1
Vancouver Style
Palaniammal S, Saritha K. MHD VISCOUS CASSONFLUID FLOW IN THE PRESENCE OF A TEMPERATURE GRADIENT DEPENDENT HEAT SINK WITH PRESCRIBED HEAT AND MASS FLUX. Front Heat Mass Transf. 2018;10(1):1-10 https://doi.org/10.5098/hmt.10.1
IEEE Style
S. Palaniammal and K. Saritha, “MHD VISCOUS CASSONFLUID FLOW IN THE PRESENCE OF A TEMPERATURE GRADIENT DEPENDENT HEAT SINK WITH PRESCRIBED HEAT AND MASS FLUX,” Front. Heat Mass Transf., vol. 10, no. 1, pp. 1-10, 2018. https://doi.org/10.5098/hmt.10.1



cc Copyright © 2018 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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