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Effect of Suspended Particles on the Onset of Thermal Convection in a Compressible Viscoelastic Fluid in a Darcy-Brinkman Porous Medium

G. C. Rana1, R. C. Thakur2

Department of Mathematics, NSCBM Govt. P. G. College, Hamirpur-177 005, Himachal Pradesh, INDIA
Department of Mathematics, Government P. G. College Dhaliara-177103, Himachal Pradesh, INDIA

Fluid Dynamics & Materials Processing 2013, 9(3), 251-265. https://doi.org/10.3970/fdmp.2013.009.251

Abstract

In this paper, the effect of suspended particles on thermal convection in a compressible viscoelastic fluid hosted in a porous medium is considered. For the porous medium, the Brinkman model is employed with the Rivlin-Ericksen approach used in parallel to describe the rheological behaviour of the viscoelastic fluid. By applying a normal mode analysis method, a dispersion relation is derived and solved analytically. It is observed that the medium permeability, suspended particles, gravity field and viscoelasticity introduce oscillatory modes. For stationary convection, it is found that the Darcy-Brinkman number has a stabilizing effect whereas the suspended particles and medium permeability have a destabilizing influence on the system.

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APA Style
Rana, G.C., Thakur, R.C. (2013). Effect of suspended particles on the onset of thermal convection in a compressible viscoelastic fluid in a darcy-brinkman porous medium. Fluid Dynamics & Materials Processing, 9(3), 251-265. https://doi.org/10.3970/fdmp.2013.009.251
Vancouver Style
Rana GC, Thakur RC. Effect of suspended particles on the onset of thermal convection in a compressible viscoelastic fluid in a darcy-brinkman porous medium. Fluid Dyn Mater Proc. 2013;9(3):251-265 https://doi.org/10.3970/fdmp.2013.009.251
IEEE Style
G.C. Rana and R.C. Thakur, “Effect of Suspended Particles on the Onset of Thermal Convection in a Compressible Viscoelastic Fluid in a Darcy-Brinkman Porous Medium,” Fluid Dyn. Mater. Proc., vol. 9, no. 3, pp. 251-265, 2013. https://doi.org/10.3970/fdmp.2013.009.251



cc Copyright © 2013 The Author(s). Published by Tech Science Press.
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