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A New Elastoplastic 3D Sand Production Model for Fractured Gas Fields

by Hongtao Liu, Hongtao Jing, Zhixiong Tu*, Shiyong Qin, Junhui Wei, Xiaotong Yu

Tarim Oilfield Oil and Gas Engineering Research Institute, Korla, 841000, China

* Corresponding Author: Zhixiong Tu. Email: email

Fluid Dynamics & Materials Processing 2023, 19(7), 1851-1862. https://doi.org/10.32604/fdmp.2023.025015

Abstract

Reservoirs characterized by high temperature, high-pressure, medium high cementation strength, low porosity, and low permeability, in general, are not affected by sand production issues. Since 2009, however, it is known that cases exists where sand is present and may represent a significant technical problem (e.g., the the Dina II condensate gas field). In the present study, the main factors affecting sand production in this type of reservoir are considered (mechanical properties, stress fields, production system, completion method and gas flow pattern changes during the production process). On this basis, a new liquid-solid coupled porous elasto-plastic 3D sand production model is introduced and validated through comparison with effective sand production data. The related prediction errors are found to be within 15%, which represents the necessary prerequisite for the utilization of such a model for the elaboration of sand prevention measures.

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APA Style
Liu, H., Jing, H., Tu, Z., Qin, S., Wei, J. et al. (2023). A new elastoplastic 3D sand production model for fractured gas fields. Fluid Dynamics & Materials Processing, 19(7), 1851-1862. https://doi.org/10.32604/fdmp.2023.025015
Vancouver Style
Liu H, Jing H, Tu Z, Qin S, Wei J, Yu X. A new elastoplastic 3D sand production model for fractured gas fields. Fluid Dyn Mater Proc. 2023;19(7):1851-1862 https://doi.org/10.32604/fdmp.2023.025015
IEEE Style
H. Liu, H. Jing, Z. Tu, S. Qin, J. Wei, and X. Yu, “A New Elastoplastic 3D Sand Production Model for Fractured Gas Fields,” Fluid Dyn. Mater. Proc., vol. 19, no. 7, pp. 1851-1862, 2023. https://doi.org/10.32604/fdmp.2023.025015



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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