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Numerical Simulation of Droplets Interacting with a Microcolumnar Solid Structure

Liang Yang*, Tianle Xi, Zhixing Wang

College of Mechanical Engineering, Dalian Jiaotong University, Dalian, 116028, China

* Corresponding Author: Liang Yang. Email: email

Fluid Dynamics & Materials Processing 2023, 19(6), 1585-1608. https://doi.org/10.32604/fdmp.2023.024987

Abstract

The VOF method is used to simulate the dynamics of a droplet interacting with a structure consisting of an array of microcolumns mounted on a flat surface. Such a specific configuration is intended to mimic the typical properties of lotus leaves, which typically display regularly arranged micron-scale papillary structures. After setting the initial velocity of the simulated droplet on the basis of practical considerations, an analysis is conducted about the effect of the characteristic size of the microstructure on the apparent contact angle. The pressure variation in the microstructure caves is also examined. The simulation results show that the change of the contact angle of the droplet in the quasi-static state is consistent with theoretical calculations and the contact angle in the dynamic state is smaller than that in the quasi-static state. Moreover, under dynamic conditions, the pressure fluctuation in the microstructure cave depends essentially on the characteristic size of the microstructure.

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APA Style
Yang, L., Xi, T., Wang, Z. (2023). Numerical simulation of droplets interacting with a microcolumnar solid structure. Fluid Dynamics & Materials Processing, 19(6), 1585-1608. https://doi.org/10.32604/fdmp.2023.024987
Vancouver Style
Yang L, Xi T, Wang Z. Numerical simulation of droplets interacting with a microcolumnar solid structure. Fluid Dyn Mater Proc. 2023;19(6):1585-1608 https://doi.org/10.32604/fdmp.2023.024987
IEEE Style
L. Yang, T. Xi, and Z. Wang, “Numerical Simulation of Droplets Interacting with a Microcolumnar Solid Structure,” Fluid Dyn. Mater. Proc., vol. 19, no. 6, pp. 1585-1608, 2023. https://doi.org/10.32604/fdmp.2023.024987



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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