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Simulation and Optimization of the Fluid Solidification Process in Brazed Plate Heat Exchangers

Weiting Jiang1,*, Lei Zhao1,*, Chongyang Wang2, Tingni He1, Weiguo Pan1

1 College of Energy and Mechanical Engineering, Shanghai University of Electric Power, Shanghai, 201306, China
2 CGN New Energy Holdings Co., Ltd., Shanghai Branch, Shanghai, 200241, China

* Corresponding Authors: Weiting Jiang. Email: email; Lei Zhao. Email: email

(This article belongs to the Special Issue: CFD Modeling and Multiphase Flows)

Fluid Dynamics & Materials Processing 2023, 19(10), 2597-2611. https://doi.org/10.32604/fdmp.2023.027504

Abstract

When a brazed plate heat exchanger is used as an evaporator, the working mass in the channel may undergo solidification, thereby hindering the refrigeration cycle. In this study the liquid solidification process and its optimization in a brazed plate heat exchanger are investigated numerically for different inlet velocities; moreover, different levels of corrugation are considered. The results indicate that solidification first occurs around the contacts, followed by the area behind the contacts. It is also shown that dead flow zones exist in the sharp areas and such areas are prone to liquid solidification. After optimization, the solidification area attains its smallest value when a corrugation spacing λ = 4.2 mm is considered.

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APA Style
Jiang, W., Zhao, L., Wang, C., He, T., Pan, W. (2023). Simulation and optimization of the fluid solidification process in brazed plate heat exchangers. Fluid Dynamics & Materials Processing, 19(10), 2597-2611. https://doi.org/10.32604/fdmp.2023.027504
Vancouver Style
Jiang W, Zhao L, Wang C, He T, Pan W. Simulation and optimization of the fluid solidification process in brazed plate heat exchangers. Fluid Dyn Mater Proc. 2023;19(10):2597-2611 https://doi.org/10.32604/fdmp.2023.027504
IEEE Style
W. Jiang, L. Zhao, C. Wang, T. He, and W. Pan, “Simulation and Optimization of the Fluid Solidification Process in Brazed Plate Heat Exchangers,” Fluid Dyn. Mater. Proc., vol. 19, no. 10, pp. 2597-2611, 2023. https://doi.org/10.32604/fdmp.2023.027504



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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