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Experimental Electromagnetic Characterization of High Temperature Superconductors Coils Located in Proximity to Electromagnetically Active Materials

by Yazid Statra, Sara Fawaz, Hocine Menana*, Bruno Douine

Université de Lorraine, GREEN, Nancy, F-54000, France

* Corresponding Author: Hocine Menana. Email: email

(This article belongs to the Special Issue: Materials and Energy an Updated Image for 2021)

Fluid Dynamics & Materials Processing 2022, 18(5), 1529-1537. https://doi.org/10.32604/fdmp.2022.021827

Abstract

The electromagnetic properties of high temperature superconductors (HTS) are characterized with the explicit intent to improve their integration in electric power systems. A tape and a coil made of Bismuth Strontium Calcium Copper Oxide (BSCCO) are considered in the presence of electromagnetically active materials in order to mimic properly the electromagnetic environment typical of electrical machines. The characterization consists of the determining the critical current and the AC losses at different values of the frequency and the transport current. The effects induced by the proximity of the active materials are studied and some related experimental issues are analyzedc.

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APA Style
Statra, Y., Fawaz, S., Menana, H., Douine, B. (2022). Experimental electromagnetic characterization of high temperature superconductors coils located in proximity to electromagnetically active materials. Fluid Dynamics & Materials Processing, 18(5), 1529-1537. https://doi.org/10.32604/fdmp.2022.021827
Vancouver Style
Statra Y, Fawaz S, Menana H, Douine B. Experimental electromagnetic characterization of high temperature superconductors coils located in proximity to electromagnetically active materials. Fluid Dyn Mater Proc. 2022;18(5):1529-1537 https://doi.org/10.32604/fdmp.2022.021827
IEEE Style
Y. Statra, S. Fawaz, H. Menana, and B. Douine, “Experimental Electromagnetic Characterization of High Temperature Superconductors Coils Located in Proximity to Electromagnetically Active Materials,” Fluid Dyn. Mater. Proc., vol. 18, no. 5, pp. 1529-1537, 2022. https://doi.org/10.32604/fdmp.2022.021827



cc Copyright © 2022 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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