Vol.17, No.3, 2021, pp.569-586, doi:10.32604/fdmp.2021.014711
OPEN ACCESS
ARTICLE
Influence of Nozzle Orifice Shape on the Atomization Process of Si3N4 in a Dry Granulation Process
  • Dongling Yu1, Huiling Zhang1, Xu Zeng1, Dahai Liao1,*, Nanxing Wu2,*
1 School of Mechanical and Electronic Engineering, Jingdezhen Ceramic Institute, Jingdezhen, 333403, China
2 National Engineering Research Center for Domestic & Building Ceramics, Jingdezhen, 333001, China
* Corresponding Author: Dahai Liao. Email: ; Nanxing Wu. Email:
Received 23 October 2020; Accepted 05 February 2021; Issue published 29 April 2021
Abstract
In order to reveal the intrinsic fluid-dynamic mechanisms of a pressure-swirl nozzle used for Si3N4 dry granulation, and effectively predict its external spray characteristics, the dynamics of air-atomized liquid two-phase flow is analyzed using a VOF (Volume of Fraction) method together with the modified realizable k-ε turbulence model. The influence of nozzle orifice shape on velocity distribution, pressure distribution is studied. The results show that the pressure difference in a convergent conical nozzle is the largest with a hollow air core being formed in the nozzle. The corresponding velocity of atomized liquid at nozzle orifice is the largest. Using a self-designed atomization experiment platform, the velocity and pressure of atomized liquid and the spray cone angle are measured for three nozzles with different orifice shapes. The micro-morphology of Si3N4 particles is also determined. These data confirm the correctness of numerical simulation. Considering atomization performance of the nozzle, the contraction conical nozzle is more suitable for the atomization of Si3N4 in practical production based on the dry granulation approach.
Keywords
Si3N4 dry granulation; pressure-swirl nozzle; VOF method; nozzle orifice shape
Cite This Article
Yu, D., Zhang, H., Zeng, X., Liao, D., Wu, N. (2021). Influence of Nozzle Orifice Shape on the Atomization Process of Si3N4 in a Dry Granulation Process. FDMP-Fluid Dynamics & Materials Processing, 17(3), 569–586.
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