Open Access

ARTICLE

Modeling and Simulation of a Hybrid Jet-Impingement/Micro-Channel Heat Sink

by Taidong Xu^1,2, Hao Liu², Dejun Zhang^1,2, Yadong Li², Xiaoming Zhou^2,*

1 Research Institute of CSIC, Nanjing, 211153, China
2 University of Electronic Science and Technology of China, Chengdu, 611731, China

* Corresponding Author: Xiaoming Zhou. Email:

(This article belongs to the Special Issue: Bioheat Transfer in Micro and Macro Scales)

Fluid Dynamics & Materials Processing 2021, 17(1), 109-121. https://doi.org/10.32604/fdmp.2021.010608

Received 13 March 2020; Accepted 22 December 2020; Issue published 09 February 2021

Abstract

With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit, new strategies are needed to extract heat from these devices in an efficient way. In this regard methods based on the combination of the so-called “jet impingement” and “micro-channel” approaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical fields. In this paper, a hybrid heat sink based on these two technologies is analysed in the frame of an integrated model. Dedicated CFD simulation of the coupled flow/temperature fields and orthogonal tests are performed in order to optimize the overall design. The influence of different sets of structural parameters on the cooling performance is examined. It is shown that an optimal scheme exists for which favourable performance can be obtained in terms of hot spot temperature decrease and thermal uniformity improvement.

---

Keywords

---