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A Novel Approach for the Numerical Simulation of Fluid-Structure Interaction Problems in the Presence of Debris

by Miaomiao Ren, Xiaobin Shu

Luohe Vocational College of Food, Luohe, 462300, China

* Corresponding Author: Miaomiao Ren. Email: email

(This article belongs to the Special Issue: EFD and Heat Transfer II)

Fluid Dynamics & Materials Processing 2020, 16(5), 979-991. https://doi.org/10.32604/fdmp.2020.09563

Abstract

A novel algorithm is proposed for the simulation of fluid-structure interaction problems. In particular, much attention is paid to natural phenomena such as debris flow. The fluid part (debris flow fluid) is simulated in the framework of the smoothed particle hydrodynamics (SPH) approach, while the solid part (downstream obstacles) is treated using the finite element method (FEM). Fluid-structure coupling is implemented through dynamic boundary conditions. In particular, the software “TensorFlow” and an algorithm based on Python are combined to conduct the required calculations. The simulation results show that the dynamics of viscous and non-viscous debris flows can be extremely different when there are obstacles in the downstream direction. The implemented SPH-FEM coupling method can simulate the fluid-structure coupling problem with a reasonable approximation.

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APA Style
Ren, M., Shu, X. (2020). A novel approach for the numerical simulation of fluid-structure interaction problems in the presence of debris. Fluid Dynamics & Materials Processing, 16(5), 979-991. https://doi.org/10.32604/fdmp.2020.09563
Vancouver Style
Ren M, Shu X. A novel approach for the numerical simulation of fluid-structure interaction problems in the presence of debris. Fluid Dyn Mater Proc. 2020;16(5):979-991 https://doi.org/10.32604/fdmp.2020.09563
IEEE Style
M. Ren and X. Shu, “A Novel Approach for the Numerical Simulation of Fluid-Structure Interaction Problems in the Presence of Debris,” Fluid Dyn. Mater. Proc., vol. 16, no. 5, pp. 979-991, 2020. https://doi.org/10.32604/fdmp.2020.09563



cc Copyright © 2020 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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