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Simulation of Thermal Fluid-structure Interaction Phenomena in a Liquid Sodium Porous System

Yan Shen1, Hong Zhang1,2,3, Hui Xu1, Tong Bai1, Ping Yu1

College of Energy Engineering, Nanjing Tech University, Nanjing Jiangsu, PR China
Changzhou Institute of Technology, Changzhou, PR China.
Corresponding Author. Email: hzhang@njtech.edu.cn

Fluid Dynamics & Materials Processing 2014, 10(1), 63-81. https://doi.org/10.3970/fdmp.2014.010.063

Abstract

Single-unit and multi-unit models of porous media (metal felts) have been used to investigate thermal fluid-structure interaction phenomena in a liquid sodium system. Micro-scale aspects have been studied via numerical simulations. The permeability of metal felts has been measured experimentally to verify the reliability of the models used. This integrated approach has allowed a proper evaluation of the interdependencies among phenomena on different scales (including relevant information on skeleton deformation and pressure drop as a function of different parameters). Pressure drop generally increases with velocity and heat flux for both laminar and turbulent flows. The final deformation is greater when turbulence is considered. When the flow is laminar and its rate changes linearly with time, the deformation amount also varies linearly.

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APA Style
Shen, Y., Zhang, H., Xu, H., Bai, T., Yu, P. (2014). Simulation of thermal fluid-structure interaction phenomena in a liquid sodium porous system. Fluid Dynamics & Materials Processing, 10(1), 63-81. https://doi.org/10.3970/fdmp.2014.010.063
Vancouver Style
Shen Y, Zhang H, Xu H, Bai T, Yu P. Simulation of thermal fluid-structure interaction phenomena in a liquid sodium porous system. Fluid Dyn Mater Proc. 2014;10(1):63-81 https://doi.org/10.3970/fdmp.2014.010.063
IEEE Style
Y. Shen, H. Zhang, H. Xu, T. Bai, and P. Yu, “Simulation of Thermal Fluid-structure Interaction Phenomena in a Liquid Sodium Porous System,” Fluid Dyn. Mater. Proc., vol. 10, no. 1, pp. 63-81, 2014. https://doi.org/10.3970/fdmp.2014.010.063



cc Copyright © 2014 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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