Tech Science Press

Special Issue "Advanced Technology of Micro and Nano Flow and Structures for Thermal Management of Electronic Components and Energy Storage"

Submission Deadline: 01 May 2022

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Guest Editors

Prof. Cong Qi, China University of Mining and Technology, China
Prof. Wenpeng Hong, Northeast Electric Power University, China
Prof. Yuling Zhai, Kunming University of Science and Technology, China
Dr. Guice Yao, Beihang University, China
Prof. Davood Toghraie, Islamic Azad University, Khomeinishar

Summary

Due to the energy crisis and energy inefficiency, advanced technology of micro and nano flow and structures, as an effective means of heat transfer enhancement, is becoming more significant and has attracted more and more attention. This section aims to develop advanced technology of micro and nano flow and structures, and reveal the mechanism of heat transfer enhancement at the micro-nano scale. Both original research and review articles on micro-nano scale heat transfer enhancement technologies are highly welcome.

The special issue covers a wide range of topics, including:, but not limited to

• Advanced technology of nanofluids;

• Advanced technology of microchannel;

• Advanced technology of microstructure;

• Advanced technology of porous medium;

• Advanced technology of bionic structure;

• Advanced technology of modified surface;

• Advanced technology of nano-film;

• Advanced technology of heat pipe;

• Lattice Boltzmann model.

Keywords

Thermal management of electronic components; energy storage; nanofluids; microchannel; microstructure; bionic structure; Lattice Boltzmann model