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Numerical Modeling of Grain Structure in Continuous Casting of Steel

A.Z. Lorbiecka1, R.Vertnik2, H.Gjerkeš1, G. Manojlovič2, B.Senčič2, J. Cesar2, B.Šarler1,3

Laboratory for Multiphase Processes, University of Nova Gorica, Slovenia
Štore Steel Company, d.o.o. Štore, Slovenia
Corresponding author. Email: bozidar.sarler@p-ng.si

Computers, Materials & Continua 2008, 8(3), 195-208. https://doi.org/10.3970/cmc.2008.008.195

Abstract

A numerical model is developed for the simulation of solidification grain structure formation (equiaxed to columnar and columnar to equiaxed transitions) during the continuous casting process of steel billets. The cellular automata microstructure model is combined with the macroscopic heat transfer model. The cellular automata method is based on the Nastac's definition of neighborhood, Gaussian nucleation rule, and KGT growth model. The heat transfer model is solved by the meshless technique by using local collocation with radial basis functions. The microscopic model parameters have been adjusted with respect to the experimental data for steel 51CrMoV4. Simulations have been carried out for nominal casting conditions, reduced casting temperature, and reduced casting speed. Proper response of the multiscale model with respect to the observed grain structures has been proved.

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APA Style
Lorbiecka, A., R.Vertnik, , H.Gjerkeš, , Manojlovič, G., B.Senčič, et al. (2008). Numerical modeling of grain structure in continuous casting of steel. Computers, Materials & Continua, 8(3), 195-208. https://doi.org/10.3970/cmc.2008.008.195
Vancouver Style
Lorbiecka A, R.Vertnik , H.Gjerkeš , Manojlovič G, B.Senčič , Cesar J, et al. Numerical modeling of grain structure in continuous casting of steel. Comput Mater Contin. 2008;8(3):195-208 https://doi.org/10.3970/cmc.2008.008.195
IEEE Style
A. Lorbiecka et al., “Numerical Modeling of Grain Structure in Continuous Casting of Steel,” Comput. Mater. Contin., vol. 8, no. 3, pp. 195-208, 2008. https://doi.org/10.3970/cmc.2008.008.195



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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