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Second Nearest-Neighbor Modified Embedded Atom Method Interatomic Potential for Cu-Ni-Sn Ternary System

Jialiang Dong1,2, Xuemao Dong3,4, Zhongxue Feng3,4,*, Caiju Li3,4, Jianhong Yi3,4, Jun Tan5,*

1 School of Materials Science and Engineering, Guizhou Minzu University, Guiyang, 550025, China
2 Guangdong Key Laboratory for Advanced Metallic Materials Processing and Forming, National Engineering Research Center of Near-Net-Shape Forming for Metallic Materials, South China University of Technology, Guangzhou, 510640, China
3 Faculty of Electronic and Information Engineering, Anshun University, Anshun, 561000, China
4 Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China
5 College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China

* Corresponding Authors: Zhongxue Feng. Email: email; Jun Tan. Email: email

(This article belongs to the Special Issue: Advances in Computational Materials Science: Focusing on Atomic-Scale Simulations and AI-Driven Innovations)

Computers, Materials & Continua 2025, 83(1), 65-77. https://doi.org/10.32604/cmc.2025.059727

Abstract

To explore atomic-level phenomena in the Cu-Ni-Sn alloy, a second nearest-neighbor modified embedded-atom method (2NN MEAM) potential has been developed for the Cu-Ni-Sn system, building upon the work of other researchers. This potential demonstrates remarkable accuracy in predicting the lattice constant, with a relative error of less than 0.5% when compared to density functional theory (DFT) results, and it achieves a 10% relative error in the enthalpy of formation compared to experimental data, marking substantial advancements over prior models. The bulk modulus is predicted with a relative error of 8% compared to DFT. Notably, the potential effectively simulates the processes of melting and solidification of Cu-15Ni-8Sn, with a simulated melting point that closely aligns with the experimental value, within a 7.5% margin. This serves as a foundation for establishing a 2NN MEAM potential for a flawless Cu-Ni-Sn system and its microalloying systems.

Keywords

2NN MEAM; Cu-Ni-Sn; interatomic potential; atomistic simulation

Cite This Article

APA Style
Dong, J., Dong, X., Feng, Z., Li, C., Yi, J. et al. (2025). Second nearest-neighbor modified embedded atom method interatomic potential for cu-ni-sn ternary system. Computers, Materials & Continua, 83(1), 65–77. https://doi.org/10.32604/cmc.2025.059727
Vancouver Style
Dong J, Dong X, Feng Z, Li C, Yi J, Tan J. Second nearest-neighbor modified embedded atom method interatomic potential for cu-ni-sn ternary system. Comput Mater Contin. 2025;83(1):65–77. https://doi.org/10.32604/cmc.2025.059727
IEEE Style
J. Dong, X. Dong, Z. Feng, C. Li, J. Yi, and J. Tan, “Second Nearest-Neighbor Modified Embedded Atom Method Interatomic Potential for Cu-Ni-Sn Ternary System,” Comput. Mater. Contin., vol. 83, no. 1, pp. 65–77, 2025. https://doi.org/10.32604/cmc.2025.059727



cc Copyright © 2025 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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