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HMFM: A Method for Identifying High-Value Patents by Fusing Multiple Features

Na Deng, Jiuan Zhang*

School of Computer Science, Hubei University of Technology, Wuhan, 430068, China

* Corresponding Author: Jiuan Zhang. Email: email

Computers, Materials & Continua 2025, 82(2), 2235-2254. https://doi.org/10.32604/cmc.2024.058103

Abstract

Rapid and accurate identification of high-quality patents can accelerate the transformation process of scientific and technological achievements, optimize the management of intellectual property rights and enhance the vitality of innovation. Aiming at the shortcomings of the traditional high-value patent assessment method, which is relatively simple and seldom considers the influence of patentees, this paper proposes a high-quality patent method HMFM (High-Value Patent Multi-Feature Fusion Method) that fuses multi-dimensional features. A weighted node importance assessment method in complex network called GLE (Glob-Local-struEntropy) based on improved structural entropy is designed to calculate the influence of the patentee to form the patentee’s features, and the patent text features are extracted by BERT-DPCNN deep learning model, which is supplemented to the basic patent indicator system. Finally a machine learning algorithm is used to assess the value of patents. Experiment results show that our method can identify high-value patents more effectively and accurately.

Keywords

Patents; high value assessment; deep learning; structural entropy; complex networks; BERT; DPCNN

Cite This Article

APA Style
Deng, N., Zhang, J. (2025). HMFM: A Method for Identifying High-Value Patents by Fusing Multiple Features. Computers, Materials & Continua, 82(2), 2235–2254. https://doi.org/10.32604/cmc.2024.058103
Vancouver Style
Deng N, Zhang J. HMFM: A Method for Identifying High-Value Patents by Fusing Multiple Features. Comput Mater Contin. 2025;82(2):2235–2254. https://doi.org/10.32604/cmc.2024.058103
IEEE Style
N. Deng and J. Zhang, “HMFM: A Method for Identifying High-Value Patents by Fusing Multiple Features,” Comput. Mater. Contin., vol. 82, no. 2, pp. 2235–2254, 2025. https://doi.org/10.32604/cmc.2024.058103



cc Copyright © 2025 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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