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Intelligent Service Search Model Using Emerging Technologies

by Farhan Amin, Gyu Sang Choi*

Department of Information and Communication Engineering, Yeungnam University, Gyeongsan, 38541, Korea

* Corresponding Author: Gyu Sang Choi. Email: email

(This article belongs to the Special Issue: The Next Generation of Artificial Intelligence and the Intelligent Internet of Things)

Computers, Materials & Continua 2023, 77(1), 1165-1181. https://doi.org/10.32604/cmc.2023.040693

Abstract

In recent years, the Internet of Things (IoT) has played a vital role in providing various services to users in a smart city. However, searching for services, objects, data, and frameworks remains a concern. The technological advancements in Cyber-Physical Systems (CPSs) and the Social Internet of Things (SIoT) open a new era of research. Thus, we propose a Cyber-Physical-Social Systems (CPSs) for service search. Herein, service search and object discovery operation carries with the suitable selection of friends in the network. Our proposed model constructs a graph and performs social network analysis (SNA). We suggest degree centrality, clustering, and scale-free emergence and show that a rational selection of friends per service exploration increases the overall network navigability. The efficiency of our proposed system is verified using real-world datasets based on service processing time, path length, giant component, and network diameter. The simulation results proved that our proposed system is efficient, robust, and scalable.

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Cite This Article

APA Style
Amin, F., Choi, G.S. (2023). Intelligent service search model using emerging technologies. Computers, Materials & Continua, 77(1), 1165-1181. https://doi.org/10.32604/cmc.2023.040693
Vancouver Style
Amin F, Choi GS. Intelligent service search model using emerging technologies. Comput Mater Contin. 2023;77(1):1165-1181 https://doi.org/10.32604/cmc.2023.040693
IEEE Style
F. Amin and G. S. Choi, “Intelligent Service Search Model Using Emerging Technologies,” Comput. Mater. Contin., vol. 77, no. 1, pp. 1165-1181, 2023. https://doi.org/10.32604/cmc.2023.040693



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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