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Internet of Cultural Things: Current Research, Challenges and Opportunities

by Xiaoting Liang1, Fang Liu1,*, Linqi Wang1, Baoying Zheng1, Yiyuan Sun2

1 Hunan University, Changsha, 410082, China
2 University of the Arts London, London, SW1P 4JU, UK

* Corresponding Author: Fang Liu. Email: email

Computers, Materials & Continua 2023, 74(1), 469-488. https://doi.org/10.32604/cmc.2023.029641

Abstract

Driven by the visions of the Internet of Things (IoT), Artificial Intelligence (AI), and 5G communications, the Internet of Cultural Things (IoCT) realize the comprehensive interconnection among cultural products, cultural services, cultural resources, and cultural platforms, bringing individuals with richer humanistic experience, increasing economic benefits for the cultural sector, and promoting the development of cultural heritage protection and education. At present, IoCT has received widespread attention in both industry and academia. To explore new research opportunities and assist users in constructing suitable IoCT systems for specific applications, this survey provides a comprehensive overview of the IoCT components and key technologies. A comparison study of representative IoCT systems is presented according to their applicability. A general platform architecture of IoCT is proposed to link cultural objects with the internet and human. Finally, open issues for research challenges and future opportunities of IoCT are also studied in this paper.

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APA Style
Liang, X., Liu, F., Wang, L., Zheng, B., Sun, Y. (2023). Internet of cultural things: current research, challenges and opportunities. Computers, Materials & Continua, 74(1), 469-488. https://doi.org/10.32604/cmc.2023.029641
Vancouver Style
Liang X, Liu F, Wang L, Zheng B, Sun Y. Internet of cultural things: current research, challenges and opportunities. Comput Mater Contin. 2023;74(1):469-488 https://doi.org/10.32604/cmc.2023.029641
IEEE Style
X. Liang, F. Liu, L. Wang, B. Zheng, and Y. Sun, “Internet of Cultural Things: Current Research, Challenges and Opportunities,” Comput. Mater. Contin., vol. 74, no. 1, pp. 469-488, 2023. https://doi.org/10.32604/cmc.2023.029641



cc Copyright © 2023 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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