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Sathish Babu Pandu1,*, A. Sagai Francis Britto2, Pudi Sekhar3, P. Vijayarajan4, Amani Abdulrahman Albraikan5, Fahd N. Al-Wesabi6, Mesfer Al Duhayyim7
1 Department of Electrical and Electronics Engineering, University College of Engineering, Panruti, 607106, India
2 Department of Mechanical Engineering, Rohini College of Engineering & Technology, Palkulam, 629401, India
3 Department of Electrical and Electronics Engineering, Vignan's Institute of Information Technology, Andra Pradesh, 530046, India
4 Department of Electrical and Electronics Engineering, University College of Engineering, BIT Campus, Tiruchirappalli, 620024, India
5 Department of Computer Science, College of Computer and Information Sciences, Princess Nourah Bint Abdulrahman University, Saudi Arabia
6 Department of Computer Science, King Khalid University, Muhayel Aseer, Saudi Arabia & Faculty of Computer and IT, Sana'a University, Sana'a, Yemen
7 Department of Natural and Applied Sciences, College of Community-Aflaj, Prince Sattam bin Abdulaziz University, Saudi Arabia
* Corresponding Author: Sathish Babu Pandu. Email:
Computers, Materials & Continua 2022, 71(1), 109-124. https://doi.org/10.32604/cmc.2022.021015
Received 19 June 2021; Accepted 27 July 2021; Issue published 03 November 2021
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